CC2640R2FYFVT.B datasheet(63/74 Pages) TI2

No de pièce	CC2640R2FYFVT.B

Description	CC2640R2F SimpleLink™ Bluetooth® 5.1 Low Energy Wireless MCU

PDF	74 Pages

Scroll/Zoom	100%

Fabricant	TI2 [Texas Instruments]

Site Internet	https://www.ti.com

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63 / 74 page

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

EXAMPLE BOARD LAYOUT

4219044/D 02/2022

www.ti.com

VQFN - 1 mm max height

RGZ0048A

PLASTIC QUADFLAT PACK- NO LEAD

SYMM

LAND PATTERN EXAMPLE

SCALE: 15X

( 5.15)

2X (6.8)

(6.8)

48X (0.6)

48X (0.24)

44X (0.5)

2X (5.5)

(5.5)

21X (Ø0.2) VIA

TYP

(R0.05)

TYP

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

EXPOSED METAL

SOLDER MASK DETAILS

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

EXPOSED METAL

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

(1.26)

2X (1.26)

2X (1.065)

(1.065)

CC2640R2FYFVT.B Fiches technique(PDF) 63 Page - Texas Instruments

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