EXAMPLE BOARD LAYOUT

DQN0004A

X2SON - 0.4 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

4215302/E 12/2016

NOTES: (continued)

7.

This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

.

8.

If any vias are implemented, it is recommended that vias under paste be filled, plugged or tented.

www.ti.com

SOLDER MASK

DEFINED

SOLDER MASK DETAIL

0.05 MIN

ALL AROUND

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

LAND PATTERN EXAMPLE

SCALE: 40X

SYMM

SYMM

1

2

3

4

4X (0.21)

4X (0.36)

(0.65)

(0.86)

(

0.48)

SEE DETAIL

4X (0.18)

(0.22) TYP

EXPOSED METAL

CLEARANCE

4X

(0.03)

EXPOSED METAL

5