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DTP-CSP Fiches technique(PDF) 37 Page - Metcal |
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DTP-CSP Fiches technique(HTML) 37 Page - Metcal |
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37 / 64 page ![]() 34 Consistingoftwoseries,theAPR-5000-XL andAPR-5000-DZSeries,thesesystems haveprecisionplacementandpowerful softwarethatmakethereworkof complexarraypackageseasy,fastand reliable. Asthereworkandrepairprocesseshaveevolved, ourtoolshavegrowntokeepupwithincreasingly sophisticatedpackages.Wedesignoursystems byworkingcloselywithcomponentsuppliersand customerstodeveloppowerful,userfriendly systemsandprocesssolutions. OurAPR-5000AdvancedPackageReworkPlatformisdesignedto facilitatereworkofeventhemostchallengingboards,includinglead-free andmulti-layerassemblies.Thesesystemsallowyoutoreflowpackages withoutincurringexcessivelidtemperatures,re-meltingsolderedjoints outsidethereworkarea,warpingofthePCBordistortingtheplastic bodiesofconnectors.Theyprovidetheincreasedthermaltransferand strictertemperaturecontrolrequiredforlead-freerework. APR-5000-DZ AdvancedPackageReworkSystemDualZone 35 APR-5000-XL AdvancedPackageReworkSystemLargeBoard 36 |
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