DTP-CSP datasheet(39/64 Pages) METCAL

39 / 64 page

Tohelpguaranteeuniformityandhigherprocessyields,theAPR-5000Seriesincorporatespowerful,efficientand

fastresponseconvectivetopreflowheaterandbottomdualzonepreheatersforfastrampandtightdelta

temperaturecontrolacrossreworkedcomponentanduniformpreheatingacrosssurfaceofthePCB.

Theenhancedsoftwareisinstructiveandintuitive,walkingtheengineerthroughthestepsofprocess

developmentandthenguidingtheoperatorthroughtheprocessstepstoensureconsistent,repeatableexecution

oftheautomaticprofilefunctions.Engineeralsohastheabilitytoassociatetutorialtoindividualprocessfile

presentingstep-by-stepinstructionsthatoperatorcanreferencequicklyandeasilyinreal-time.

Lead-Free Compatible

Astheimplementationoflead-freeassembliesintensifies,theAPR-5000seriesAdvancedPackageRework

Systemshavethepower,sizeandsophisticationtomeettherequiredhigher,cost-sensitiveperformancecriteria.

Theinnovativesinglereflow/placementheadanddualstagepreheatershelpachieveaconsistentlysmallDeltaT

acrosstheboardandthecomponent.Thermaldamageisprecludedduetothesystem'spreciselycontrolled

preheater;lead-freeprofilescanbequicklydevelopedviathesystem'sfivethermocouples;andclosed-loop,

computercontrolsandintuitivesoftwarehelpoperatorsmaintaintheidealprocessfromstarttofinish.

TheAPR-5000SeriesAdvancedPackageReworkSystemsprovidefullconvectioninbothreflowheateranddual

pre-heaterstoprovidefastrampandprecise

peakreflowtemperaturewithoutthermaldamage

tosensitivecomponentsunsuitableforheating

above240ºC.Andwithfourheatingzonesand

onecoolingzone,thepreciseprofilesneededfor

successfulsoldering/desolderingoflead-free

packagesareeasilydelivered.

TheAPR-5000SeriesAdvancedPackage

ReworkSystemsaredistinguishedbyinnovation

andflexibility.Thedualstageconvectivepre-

heatercanbeswitchedbetweeninnerandouter

stagewithinthefourheatingzonesofaprofileto

meetthehigherreworkrequirementoflead-free.

Higherthermalperformancecanbeachieved,

attachingreflownozzlestoboththetopreflow

andbottominnerstageheaterssetdirectlyabove

andbelowreworkedcomponent.Bottomnozzle

hasaddedadvantageinpreventingthermal

damagetoadjacentcomponentsonthe

undersideofthePCB.Andnewlydesignthermal

tweezertopnozzleprovidesintegrated

mechanicalactionpickupfordeviceswithlimited

surfaceareainsteadofstandardvacuumpickup.

DTP-CSP Fiches technique(PDF) 39 Page - Metcal