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TUSB1044AI Fiches technique(PDF) 63 Page - Texas Instruments |
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TUSB1044AI Fiches technique(HTML) 63 Page - Texas Instruments |
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63 / 66 page ![]() www.ti.com PACKAGE OUTLINE C 40X 0.25 0.15 4.7±0.1 40X 0.5 0.3 0.8 MAX (0.2) TYP 0.05 0.00 36X 0.4 2X 2.8 2X 4.4 2.7±0.1 A 6.1 5.9 B 4.1 3.9 WQFN - 0.8 mm max height RNQ0040A PLASTIC QUAD FLATPACK - NO LEAD 4222125/B 01/2016 PIN 1 INDEX AREA 0.08 SEATING PLANE 1 8 21 28 9 20 40 29 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 2.500 |
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