TUSB1044AI datasheet(6/66 Pages) TI1

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5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.3

VIN_DIFF

Differential voltage at differential input pins.

±2.5

VIN_SE

Single-ended input voltage at differential input pins.

–0.5

VIN_CMOS

Input voltage at CMOS inputs

–0.3

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001, all pins(1)

±5000

Charged device model (CDM), per ANSI/ESDA/

JEDEC JS-002, all pins(2)

±1500

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC

Supply voltage

3.3

3.6

VI2C

External supply which SDA and SCL are pulled up too

1.7

3.6

VPSN

Power supply noise on VCC

100

TUSB1044A ambient temperature

°C

TUSB1044AI ambient temperature

–40

°C

TUSB1044A junction temperature

105

°C

TUSB1044AI junction temperature

125

°C

5.4 Thermal Information

THERMAL METRIC(1)

Device

UNIT

RNQ (WQFN)

40 PINS

RθJA

Junction-to-ambient thermal resistance

37.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

20.7

°C/W

RθJB

Junction-to-board thermal resistance

9.5

°C/W

ΨJT

Junction-to-top characterization parameter

0.2

°C/W

ΨJB

Junction-to-board characterization parameter

9.4

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TUSB1044A

SLLSG07 – MARCH 2025

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