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M24C64-R Fiches technique(PDF) 37 Page - STMicroelectronics |
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M24C64-R Fiches technique(HTML) 37 Page - STMicroelectronics |
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37 / 54 page ![]() DS6638 Rev 36 37/54 M24C64-W M24C64-R M24C64-F M24C64-DF Package information 53 9.3 TSSOP8 package information Figure 21.TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline, package outline 1. Drawing is not to scale. Table 23. TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to four decimal digits. Min. Typ. Max. Min. Typ. Max. A - - 1.200 - - 0.0472 A1 0.050 - 0.150 0.0020 - 0.0059 A2 0.800 1.000 1.050 0.0315 0.0394 0.0413 b 0.190 - 0.300 0.0075 - 0.0118 c 0.090 - 0.200 0.0035 - 0.0079 CP - - 0.100 - - 0.0039 D 2.900 3.000 3.100 0.1142 0.1181 0.1220 e - 0.650 - - 0.0256 - E 6.200 6.400 6.600 0.2441 0.2520 0.2598 E1 4.300 4.400 4.500 0.1693 0.1732 0.1772 L 0.450 0.600 0.750 0.0177 0.0236 0.0295 L1 - 1.000 - - 0.0394 - α 0° - 8° 0° - 8° |
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