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M24C64-R Fiches technique(PDF) 48 Page - STMicroelectronics |
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M24C64-R Fiches technique(HTML) 48 Page - STMicroelectronics |
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48 / 54 page ![]() Ordering information M24C64-W M24C64-R M24C64-F M24C64-DF 48/54 DS6638 Rev 36 Table 30. Ordering information scheme (unsawn wafer)(1) (2) 1. For all information concerning the M24C64 delivered in unsawn wafer, please contact your nearest ST Sales Office. 2. Unsawn wafer in preview. Example: M24C64 - F T W 20 I /90 Device type M24 = I2C serial access EEPROM Device function C64 = 64 Kbit (8192 x 8 bit) Operating voltage F = VCC = 1.7 V to 5.5 V Process T = F8H+ Delivery form W = Wafer (bare die) Wafer thickness 20 = Non-backlapped wafer Wafer testing I = Inkless test Device grade 90 = -40°C to 85°C |
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