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PCF8579 Fiches technique(PDF) 35 Page - NXP Semiconductors |
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PCF8579 Fiches technique(HTML) 35 Page - NXP Semiconductors |
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35 / 40 page ![]() 1997 Apr 01 35 Philips Semiconductors Product specification LCD column driver for dot matrix graphic displays PCF8579 17 PACKAGE OUTLINES UNIT A1 A2 A3 bp cD(1) E(2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 0.3 0.1 3.0 2.8 0.25 0.42 0.30 0.22 0.14 21.65 21.35 11.1 11.0 0.75 15.8 15.2 1.45 1.30 0.90 0.55 7 0 o o 0.1 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) 1.6 1.4 SOT190-1 96-04-02 97-08-11 w M θ A A1 A2 b p D HE L p Q detail X E Z e c L v M A X (A ) 3 A y 56 29 28 1 pin 1 index 0.012 0.004 0.12 0.11 0.017 0.012 0.0087 0.0055 0.85 0.84 0.44 0.43 0.0295 2.25 0.089 0.62 0.60 0.057 0.051 0.035 0.022 0.004 0.2 0.008 0.004 0.063 0.055 0.01 0 5 10 mm scale VSO56: plastic very small outline package; 56 leads SOT190-1 A max. 3.3 0.13 Note 1. Plastic or metal protrusions of 0.3 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. |
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