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PCF8533 Fiches technique(PDF) 32 Page - NXP Semiconductors |
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PCF8533 Fiches technique(HTML) 32 Page - NXP Semiconductors |
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32 / 36 page ![]() This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... MGL759 PC8533-2 C2 C1 F 0, 0 x y Fig.22 Bonding pad locations. The position of the bonding pads is not to scale. Chip dimensions: approximately 5.40 × 1.51 mm. Bump dimensions: 90 × 50 × 17.5 µm. Wafer thickness: 381 µm. |
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