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IP101G-DS-R01 Fiches technique(PDF) 61 Page - List of Unclassifed Manufacturers |
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IP101G-DS-R01 Fiches technique(HTML) 61 Page - List of Unclassifed Manufacturers |
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61 / 65 page ![]() IP101G Data Sheet 7.4.4 SMI Timing MDC/MDIO Timing Requirements Table 19 SMI Timing Requirements Symbol Description Min. Typ. Max. Unit Tch MDC High Time input 150 - - ns Tcl MDC Low Time input 150 - - ns Tcm MDC period input 300 - - ns Tmd MDIO output delay (read from PHY) 5 - 15 ns Tmh MDIO setup time (write to PHY) 10 - - ns Tms MDIO hold time (write to PHY) 10 - - ns MDC MDIO Tms Tmh Write Cycle Tcl Tch Tcm Tmd MDC MDIO Read Cycle Figure 23 SMI Timing Requirements 7.5 Thermal Data Table 20 Thermal Data Package Theta JA Theta JC Psi JT Units PCB Layers Conditions 83.2 42.8 10.7 oC/W 2 48-PIN LQFP 75.3 42.4 10.5 oC/W 4 49.1 30.6 13.7 oC/W 2 32-PIN QFN 35.2 26.3 5.0 oC/W 4 1) FR4 PCB size 113mm * 95.8mm, 2) 1oz Cu for each layer, 3) 1.6mm PCB thickness, 4) Air flow @ 0m/sec. 61/65 January 14, 2014 Copyright © 2011, IC Plus Corp. IP101G-DS-R01 |
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