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CS5535 Fiches technique(PDF) 553 Page - National Semiconductor (TI) |
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CS5535 Fiches technique(HTML) 553 Page - National Semiconductor (TI) |
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553 / 555 page ![]() Revision 0.8 553 www.national.com 7.0 Package Specifications Geode™ C5535 I/O companion is packaged in a 208-terminal PBGA (plastic ball grid array). Figure 7-1 provides the mechanical dimensions of the package. Figure 7-1. 208-Terminal PBGA Package (Body Size: 23x23x2.13 mm; Pitch: 1.27 mm) NOTES: UNLESS OTHERWISE SPECIFIED. 1) SOLDER BALL COMPOSITION: SN 63%, PB 37%. 2) DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N. 3) THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION. 4) REFERENCE JEDEC REGISTRATION MO-151, VARIATION BAJ-2. |
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