Data Sheet G12847EJ7V0DS

7

µPC3403

RECOMMENDED SOLDERING CONDITIONS

The

µPC3403 should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales

representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

TYPES OF SURFACE MOUNT DEVICE

µPC3403G2: 14-pin plastic SOP (5.72 mm (225))

Process

Conditions

Symbol

Infrared Ray Reflow

Peak temperature: 230°C or below (Package surface temperature),

Reflow time: 30 seconds or less (at 210°C or higher),

Maximum number of reflow processes: 1 time.

IR30-00-1

Vapor Phase Soldering

Peak temperature: 215°C or below (Package surface temperature),

Reflow time: 40 seconds or less (at 200°C or higher),

Maximum number of reflow processes: 1 time.

VP15-00-1

Wave Soldering

Solder temperature: 260°C or below, Flow time: 10 seconds or less,

Maximum number of flow processes: 1 time,

Pre-heating temperature: 120°C or below (Package surface temperature).

WS60-00-1

Partial Heating Method

Pin temperature: 300°C or below,

Heat time: 3 seconds or less (Per each side of the device).

–

Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the

device will be damaged by heat stress.

TYPES OF THROUGH HOLE DEVICE

µPC3403C: 14-pin plastic DIP (7.62 mm (300))

Soldering

method

Soldering conditions

Recommended

condition symbol

Wave soldering

Solder temperature: 260°C or below,

Flow time: 10 seconds or below