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LIS2DUXS12 Fiches technique(PDF) 91 Page - STMicroelectronics |
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LIS2DUXS12 Fiches technique(HTML) 91 Page - STMicroelectronics |
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91 / 104 page ![]() 13 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 13.1 Soldering information The LGA package is compliant with the ECOPACK and RoHS standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. For the land pattern and soldering recommendations, consult technical note TN0018 available on www.st.com. 13.2 LGA-12 package information Figure 19. LGA-12 2.0 x 2.0 x 0.74 mm package outline and mechanical data Dimensions are in millimeter unless otherwise specified General Tolerance is +/-0.15mm unless otherwise specified OUTER DIMENSIONS ITEM DIMENSION [mm] TOLERANCE [mm] 1 . 0 ± 2 ] L [ h t g n e L 1 . 0 ± 2 ] W [ h t d i W / X A M 74 . 0 ] H [ t h g i e H DM00170568 LIS2DUXS12 Package information DS14035 - Rev 2 page 91/104 |
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