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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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LSF0102DDFR Fiches technique(PDF) 48 Page - Texas Instruments |
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LSF0102DDFR Fiches technique(HTML) 48 Page - Texas Instruments |
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48 / 57 page  www.ti.com PACKAGE OUTLINE C 4X 0.25 0.17 4X 0.30 0.22 0.40 MAX 0.05 0.00 2X 0.6 0.25 TYP +0.05 -0.03 0.4 B 1.05 0.95 A 0.85 0.75 (0.1) TYP (0.1) (0.08) (0.027) TYP X2SON - 0.4 mm max height DTQ0006A PLASTIC SMALL OUTLINE - NO LEAD 4224056/A 11/2017 PIN 1 INDEX AREA SEATING PLANE 0.05 C 1 3 4 0.1 C A B 0.05 C 5 NOTE 5 (OPTIONAL) PIN 1 ID 2 6 PKG PKG NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance. 4. The size and shape of this feature may vary. 5. Features may not exist. Recommend use of pin 1 marking on top of package for orientation purposes. SCALE 12.000 |
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