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LSF0102DDFR Fiches technique(PDF) 45 Page - Texas Instruments |
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LSF0102DDFR Fiches technique(HTML) 45 Page - Texas Instruments |
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45 / 57 page ![]() www.ti.com PACKAGE OUTLINE C 20X 0.30 0.18 1 0.1 20X 0.5 0.3 1.0 0.8 (0.2) TYP 0.05 0.00 14X 0.5 2X 3.5 2X 0.5 3 0.1 A 2.6 2.4 B 4.6 4.4 VQFN - 1 mm max height RKS0020A PLASTIC QUAD FLATPACK - NO LEAD 4222490/B 02/2021 PIN 1 INDEX AREA 0.08 C SEATING PLANE 0.1 C 1 12 11 9 10 20 19 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD 2 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 3.300 |
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