1

Product Description

DuPont

LF171

platinum/silver

conductor

composition is intended to be applied to ceramic

substrates by screen printing and firing in a

conveyor

furnace

in

an

air

(oxidizing)

atmosphere.

It has been developed to form

interconnecting tracks and pads for component

and lead attachment, in hybrid microcircuits and

networks.

Product Benefits

 Excellent fine line resolution

 Lead, cadmium, and nickel free*

 Excellent solderability with lead and lead-free

solders.

 Excellent green-strength

 Compatible, sequentially or co-fired, with

DuPont LF151 dielectric as a crossover

these are not intentionally added to the referenced product.

Trace amounts however may be present.

Processing Conditions

Printing

200 - 325 mesh stainless steel, 0.3 - 0.5 mil

emulsion. Print speeds up to 20 cm/s.

Drying

Allow prints to level for 5 - 10 minutes at room

temperature, then dry for 10 - 15 minutes at

150ºC.

Firing

850ºC peak held for 10 minutes on 30 minutes

cycle in air (oxidizing) atmosphere.

Composition Properties

DuPont LF171

PLATINUM SILVER CONDUCTOR

Technical Data Sheet

Test

Properties

Viscosity (Pa.s) [Brookfield HBT,

UC&SP @10 rpm, 25°C]

180 - 220

Thinner

DuPont 4553

Retest (months)

6

Typical Composition Properties

Shrinkage (dried to fired) [%]

35 - 40

Mean fired thickness:

(using 200 mesh) [µm]

13 - 19

typical 16

Coverage @ 16µm fired (cm²/g)

70

Resistivity (mΩ/sq @ 16µm)

≤ 2.5

Soldered

Adhesion¹

Initial (N)

≥ 20

¹ 90º wire peel test on 2mm x 2mm pad soldered with 62/36/2 Solder using mildly

activated flux, Alpha 611 on 96% Alumina.

This table shows anticipated typical physical properties for DuPont

LF171 based on specific controlled experiments in our labs and are not

intended to represent the product specifications, details of which are

available upon request.