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VSC8540XMVRT-HC Fiches technique(PDF) 82 Page - Microchip Technology |
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VSC8540XMVRT-HC Fiches technique(HTML) 82 Page - Microchip Technology |
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82 / 87 page ![]() VSC8540RT DS60001603E-page 82 2022 Microchip Technology Inc. and its subsidiaries 9.2.1 MARKING Top marking follows the example shown below: Where: Line 1 = Microchip Logo Line 2 & 3 = Device Name Line 4 = Lot Reference Number Line 5 = Date Code (YYWW), Location Code 9.2.2 THERMAL SPECIFICATIONS 9.2.3 SOLDERING PROFILE Please refer to the device’s Qualpack document, which is available upon request from your Microchip Technology sales office 9.2.4 PACKAGING RESOURCES Land Pattern Definition. Refer to the IPC Standard: IPC-7351B (Generic Requirements for Surface Mount Design and Land Pattern Standards) https://shop.ipc.org. TABLE 9-2: THERMAL RESISTANCES Symbol °C/W Parameter JB 19.5 Die junction to printed circuit board (vacuum environment) |
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