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VSC8540XMVRT-HC Fiches technique(PDF) 78 Page - Microchip Technology |
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VSC8540XMVRT-HC Fiches technique(HTML) 78 Page - Microchip Technology |
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78 / 87 page ![]() VSC8540RT DS60001603E-page 78 2022 Microchip Technology Inc. and its subsidiaries 9.0 PACKAGE INFORMATION The following sections discuss package related information. 9.1 68-Pin Plastic Very Small Quad Flat No-leads The package is a lead-free (Pb-free), 68-pin, plastic very small quad flat no-lead (VQFN) package with an exposed pad, 8 mm × 8 mm body size, 0.4 mm pin pitch, and 0.9 mm maximum height. The plastic mold compound is screened to be low Alpha. It complies with the temperatures and profiles defined in the joint IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard. |
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