SMX2_FAM_P60D080_D144_SDS

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© NXP B.V. 2010. All rights reserved.

Objective short data sheet

PUBLIC

Rev. 1 — 21 October 2010

198210

6 of 12

NXP Semiconductors

P60C080 and P60C144

Secure high-performance contact interface smart card controller

6.

Ordering information

Table 2.

Feature table (EEPROM and RAM sizes without applied implementation of MIFARE Plus and/or

DESFire EV1)

Product

type

EEPROM

[KB]

user

ROM

[KB]

total

RAM

[KB]

CXRAM

[KB]

FXRAM

[KB]

Coprocessor

MMU

Copy

machines

ISO/

IEC 7816

IO pads

interface

option

Fame2 DES AES

P60C080

80

384

8.125

5.5

2.625

yes

yes

yes

yes

2

3

ISO/IEC 7816

P60C144

144

384

8.125

5.5

2.625

yes

yes

yes

yes

2

3

ISO/IEC 7816

Table 3.

Ordering information

Type number

Package

Name

Description

Version

P60C080PU15

FFC

12 inch wafer (sawn; 150

μm thickness; on film frame carrier;

electronic fail die marking according to SECSII format)

NAU000

P60C144PU15

P60C080PHN

HVQFN32

plastic thermal enhanced very thin quad flat package; no leads;

32 terminals; body 5

× 5 × 0.85 mm

SOT617-1

P60C144PHN

P60C080PX80

PCM1.1

contact chip card module (super 35 mm tape format, 8-contact, dual

source)

SOT658-1

P60C144PX80

P60C080PX81

Pd-PCM1.1

palladium plated contact chip card module (super 35 mm tape

format, 8-contact, dual source)

SOT658-1

P60C144PX81