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LP5910 Fiches technique(PDF) 19 Page - Texas Instruments |
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LP5910 Fiches technique(HTML) 19 Page - Texas Instruments |
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19 / 31 page ![]() 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation, see the following: • Texas Instruments, AN-1112 DSBGA Wafer Level Chip Scale Package application note • Texas Instruments, Semiconductor and IC Package Thermal Metrics application report • Texas Instruments, Using New Thermal Metrics application report • Texas Instruments, Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs application report 11.2 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Subscribe to updates to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.3 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 11.4 Trademarks TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners. 11.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.6 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. www.ti.com LP5910 SNVSA91F – SEPTEMBER 2015 – REVISED APRIL 2021 Copyright © 2021 Texas Instruments Incorporated Submit Document Feedback 19 Product Folder Links: LP5910 |
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