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MC56F81663 Fiches technique(PDF) 53 Page - NXP Semiconductors

No de pièce MC56F81663
Description  DSC based on 32-bit 56800EX core
PDF  73 Pages
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Fabricant  NXP [NXP Semiconductors]
Site Internet  http://www.nxp.com
Logo NXP - NXP Semiconductors

MC56F81663 Fiches technique(HTML) 53 Page - NXP Semiconductors

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Figure 10. RC Oscillator Temperature Variation (Typical) After Trim (Preliminary)
11.4 Memories and memory interfaces
11.4.1 Flash electrical specifications
This section describes the electrical characteristics of the flash memory module.
11.4.1.1 Flash timing specifications — program and erase
The following specifications represent the amount of time the internal charge pumps are
active and do not include command overhead.
Table 24. NVM program/erase timing specifications
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
thvpgm4
Longword Program high-voltage time
—
7.5
18
μs
—
Table continues on the next page...
System modules
MC56F81xxx, Rev. 1.1, 12/2020
NXP Semiconductors
53



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