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AS4LC2M8S1 Fiches technique(PDF) 12 Page - Alliance Semiconductor Corporation

No de pièce AS4LC2M8S1
Description  3.3V 2M x 8/1M x 16 CMOS synchronous DRAM
PDF  28 Pages
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Fabricant  ALSC [Alliance Semiconductor Corporation]
Site Internet  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS4LC2M8S1 Fiches technique(HTML) 12 Page - Alliance Semiconductor Corporation

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ALLIANCE SEMICONDUCTOR
7/5/00
AS4LC2M8S1
AS4LC1M16S1
Initialize and load mode register
* DQM represents DQML and DQMH. DQML controls the lower byte, and DQMH controls the upper byte.
† The Mode Register may be loaded prior to the auto refresh cycles if desired.
ƒ Outputs are guaranteed High-Z after command is issued.
Clock suspend/power
down mode exit
CKE = high
Resume internal clock operation by asserting CKE high before the
rising edge of CLK. Subsequent commands can be issued one clock
cycle after the end of the Exit command.
Auto refresh
CS = RAS = CAS = low; WE =
CKE = high; A0~A11 = don’t
care
SDRAM storage cells must be refreshed every 64 ms to maintain data
integrity. Use the auto refresh command to accomplish the refreshing
of all rows in both banks of the SDRAM. The row address is provided
by an internal counter which increments automatically. Auto refresh
can only be asserted when both banks are idle and the device is not in
the power down mode. The time required to complete the auto refresh
operation is tRC(min). Use NOPs in the interim until the auto refresh
operation is complete. Both banks will be in the idle state after this
operation.
Self refresh
CS = RAS = CAS = CKE = low;
WE = high; A0~A11 = don’t
care
Self refresh is another mode for refreshing SDRAM cells. In this mode,
refresh address and timing are provided internally. Self refresh entry is
allowed only when both banks are idle. The internal clock and all input
buffers with the exception of CKE are disabled in this mode. Exit self
refresh by restarting the external clock and then asserting CKE high.
NOPs must follow for a time of tRC(min) for the SDRAM to reach the
idle state where normal operation is allowed. If burst auto refresh is
used in normal operation, burst 2048 auto refresh cycles immediately
after exiting self refresh.
Command
Pin settings
Description
CLK
CKE
COMMAND
DQM*
ADDRESS
DQ
T0
T1
Tm
Tn
Tp+1
Tp+2
Tp+3
tCH
tCL
tCK
tCKS
tCKH
NOP
AUTO REFRESH
NOP
tCMH
tCMS
AUTO REFRESH
NOP NOP
LOAD MODE
REGISTER
ACTIVE
CODE
tAS
tAH
BANK ROW
NOP NOP
High Z
T=200
µs
(min)
Power up:
VDD and
CLK stable.
tRP
Precharge
all banks.
(8 AUTO REFRESH
tRCAR
Program Mode Register†ƒ
tMRD
PRECHARGE
A10=HIGH
ALL
AUTO REFRESH
CYCLES)



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