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STSAFE-A110 Fiches technique(PDF) 31 Page - STMicroelectronics |
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STSAFE-A110 Fiches technique(HTML) 31 Page - STMicroelectronics |
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31 / 36 page ![]() DS13039 Rev 1 31/36 STSAFE-A110 Package information 35 6.2 UFDFPN8 package information The UFDFPN8 package is an 8-lead, 2 × 3 mm, 0.5 mm pitch, ultra thin profile fine pitch dual flat package. Figure 18. UFDFPN8 – package outline 1. Max. package warpage is 0.05 mm. 2. Exposed copper is not systematic and can appear partially or totally according to the cross section. 3. Drawing is not to scale. |
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