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STM32L021D4 Fiches technique(PDF) 97 Page - STMicroelectronics |
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STM32L021D4 Fiches technique(HTML) 97 Page - STMicroelectronics |
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97 / 114 page ![]() DocID027982 Rev 5 97/114 STM32L021x4 Package information 110 7.2 UFQFPN32 package information Figure 34. UFQFPN32 - 32-pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package outline 1. Drawing is not to scale. 2. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this backside pad to PCB ground. |
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