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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ST33TPHF2ESPI Fiches technique(PDF) 13 Page - STMicroelectronics |
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ST33TPHF2ESPI Fiches technique(HTML) 13 Page - STMicroelectronics |
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13 / 26 page  5.3 Thermal characteristics of packages The table below provides the thermal characteristics of the TSSOP28 and VFQFPN32 packages. Table 4. Thermal characteristics Parameter Symbol Value Recommended operating temperature range Ambient temperature TA −40 to 105 °C Case temperature TC - Junction temperature TJ −43 to 108 °C Absolute maximum junction temperature - 125 °C Maximum power dissipation - 63 mW Theta-JA, -JB and -JC Junction to ambient thermal resistance θJA 35.8 at 0 lfpm (1) Junction to case thermal resistance θJC 1.48 at 0 lfpm(1) Junction to board thermal resistance θJB 13.9 at 0 lfpm(1) 1. Linear feet per minute. ST33TPHF2ESPI Thermal characteristics of packages DB2716 - Rev 4 page 13/26 |
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