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STSPIN820 Fiches technique(PDF) 6 Page - STMicroelectronics

No de pièce STSPIN820
Description  Advanced 256 microsteps integrated motor driver with step-clock and direction interface
PDF  29 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STSPIN820 Fiches technique(HTML) 6 Page - STMicroelectronics

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Electrical data
STSPIN820
6/29
DocID031065 Rev 2
2
Electrical data
2.1
Absolute maximum ratings
2.2
Recommended operating conditions
2.3
Thermal data
Table 1. Absolute maximum ratings
Symbol
Parameter
Test condition
Value
Unit
VS
Supply voltage
-
-0.3 to 48
V
VIN
Logic input voltage
-
-0.3 to 5.5
V
VOUT,diff Differential voltage between VS, OUTx1, OUTx2 and SENSEx pins
-
up to 48
V
VSENSE Sense pins voltage
-
-2 to 2
V
VREF
Reference voltage input
-
-0.3 to 2
V
IOUT,RMS Continuous power stage output current (each full-bridge)
-
1.5
Arms
Tj
Junction temperature
-
-40 to 150
°C
TSTG
Storage temperature
-
-55 to 150
°C
Table 2. Recommended operating conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
VS
Supply voltage
7
-
45
V
VIN
Logic input voltage
-
-
5
V
VSENSE
Sense pins voltage
-1
-
+1
V
VREF
Reference voltage input
0.1
-
1
V
Table 3. Thermal data
Symbol
Parameter
Conditions
Value Unit
RthJA
Junction to ambient thermal resistance
Natural convection, according to JESD51-2A(1)
36.5
°C/W
RthJCtop
Junction to case thermal resistance
(top side)
Cold plate on top package, according to
JESD51-12(1)
27.6
°C/W
RthJCbot
Junction to case thermal resistance
(bottom side)
Cold plate on exposed pad, according to
JESD51-12(1)
5.9
°C/W
RthJB
Junction to board thermal resistance
according to JESD51-8(1)
13.6
°C/W
JT
Junction to top characterization
According to JESD51-2A(1)
1°C/W
JB
Junction to board characterization
According to JESD51-2A(1)
13.7
°C/W
1. Simulated on a 76.2 x 114.3 x 1.6 mm, with vias underneath the component, the 2s2p board as per the standard JEDEC
(JESD51-7) in natural convection.



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