TESEO-LIV3F datasheet(36/37 Pages) STMICROELECTRONICS

36 / 37 page

Revision history

Teseo-LIV3F

36/37

DS12152 Rev 7

Revision history

Table 12. Revision history

Date

Revision

Changes

20-Jun-2017

Initial release.

07-Aug-2017

Updated unit value for the symbol PWStandby in Table 8.

19-Dec-2017

Added Chapter 18: Labelling information.

Added Chapter 19: Reflow soldering profile

12-Apr-2018

Added Table 1: Device summary.

Updated Features in cover page from “163 dBm navigation

sensitivity” to “-163 dBm navigation sensitivity”.

Chapter 4: Assisted GNSS

– updated the sentence from “Teseo-LIV3F supports two

types of Assisted GPS.” to “Teseo-LIV3F supports three

types of Assisted GNSS.”

Added Section 4.2: Predictive AGNSS.

Added Section 17.3: ESD handling precautions .

In Table 11: Soldering profile values updated value of

“Peak temperature (TP)” from “240 + 0 °C” to “245 +/- 5 °C”

Removed Chapter “Regulatory compliance”.

01-Aug-2018

Added Section 17.4: Moisture sensitivity levels.

16-Apr-2019

Updated Features in cover page.

Updated Figure 3: Teseo-LIV3F mechanical specification.

Added Chapter 14: Regulatory compliance.

20-Sep-2019

Updated Table 2: GNSS performance

TESEO-LIV3F Fiches technique(PDF) 36 Page - STMicroelectronics