MP3275AE datasheet(5/16 Pages) EXAR

5 / 16 page

MP3275

Rev. 4.00

ELECTRICAL CHARACTERISTICS TABLE (CONT’D)

Description

Symbol

Min

Typ

Max

Min

Max

Units

Conditions

DIGITAL OUTPUTS

COUT=15 pF

(Data Format 2’s Complement)

SDO, STS, STL

Logical “1” Voltage

VOH

4.0

2.4

ISOURCE = 0.5 mA

Logical “0” Voltage

VOL

0.4

ISINK = 1.6 mA

Tristate Leakage

IOZ

–5

µAVOUT=GND to VDD

POWER SUPPLIES

Operating Range

VDD

+4.5

+5.5

+4.5

+5.5

VCC

+11.4

+16.5

+11.4

+16.5

VEE

–4.75

–16.5

–4.75

–16.5

Tested at –11.4 and –16.5 only

Operating Current

IDD

ICC

IEE

1.5

Power Dissipation

110

200

°C

Tmin to Tmax

NOTES

Tester measures code transitions by dithering the voltage of the analog input (VIN). The difference between the measured and the

ideal code width is the DNL error. The INL error is the maximum distance (in LSB’s) from the best fit line to any transition voltage

Guaranteed. Not tested.

All channel input pins and ground reference pin have protection which becomes active above

60 V.

All digital inputs have diodes to VDD and AGND. Input DC currents will not exceed specified limits for any input voltage between

AGND and VDD.

Specifications are subject to change without notice

ABSOLUTE MAXIMUM RATINGS (TA = +25

°C unless otherwise noted)1, 2

VCC to AGND

0 to +16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

VEE to AGND

0 to –16.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . .

VDD to AGND

0 to +7 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

AGND to DGND

±1 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Digital Inputs or Outputs (WR, RD, CS, AB0-AB4, ADEN,

SDC) to DGND

–0.5 V to VDD +0.5 V

. . . . . . . . . . . . . . . . . .

Analog Inputs (AIN0 – AIN15, GND REF)

to AGND

±60 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

REF OUT

Indefinite short to DGND,

. . . . . . . . . . . . . . . . . . .

Momentary short to VCC

Maximum Junction Temperature

150

°C

. . . . . . . . . . . . . . . . .

Package Power Dissipation Rating to 75

°C

PQFP

750 mW

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Derates above 75

°C

10 mW/

°C

. . . . . . . . . . . . . . . . . . . . .

Lead Temperature, Soldering

300

°C, 10 Sec

. . . . . . . . . . . .

Storage Temperature (Ceramic)

–65

°C to +150°C

. . . . . . . .

NOTES:

Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a

stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating

conditions for extended periods may affect device reliability.

Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps

(HP5082-2835) from input pin to the supplies.

All logic inputs have protection diodes which will protect the device from

short transients outside the supplies of less than 100mA for less than 100

µs.

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