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ICS2309 Fiches technique(PDF) 7 Page - Integrated Circuit Systems |
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ICS2309 Fiches technique(HTML) 7 Page - Integrated Circuit Systems |
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7 / 9 page ![]() 3.3 VOLT ZERO DELAY, LOW SKEW BUFFER MDS 2309 D 7 Revision 052405 In te gr ated Circuit Systems ● 5 25 Race Stree t, San Jose, CA 951 26 ● te l (40 8) 2 97-12 01 ● www.icst.com ICS2309 Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 Thermal Characteristics for 16SOIC Parameter Symbol Conditions Min. Typ. Max. Units Thermal Resistance Junction to Ambient θ JA Still air 120 °C/W θ JA 1 m/s air flow 115 °C/W θ JA 3 m/s air flow 105 °C/W Thermal Resistance Junction to Case θ JC 58 °C/W INDEX AREA 1 2 16 D E SEATING PLANE A1 A e - C - B .10 (.004) C C L H h x 45 Millimeters Inches Symbol Min Max Min Max A 1.35 1.75 .0532 .0688 A1 0.10 0.25 .0040 .0098 B 0.33 0.51.013.020 C 0.19 0.25 .0075 .0098 D 9.80 10.00 .3859 .3937 E 3.80 4.00 .1497 .1574 e 1.27 BASIC 0.050 BASIC H 5.80 6.20 .2284 .2440 h 0.25 0.50.010.020 L 0.40 1.27.016.050 α 0 ° 8 ° 0 ° 8 ° |
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