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ICS2309 Fiches technique(PDF) 6 Page - Integrated Circuit Systems

No de pièce ICS2309
Description  3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
PDF  9 Pages
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Fabricant  ICST [Integrated Circuit Systems]
Site Internet  http://www.icst.com
Logo ICST - Integrated Circuit Systems

ICS2309 Fiches technique(HTML) 6 Page - Integrated Circuit Systems

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3.3 VOLT ZERO DELAY, LOW SKEW BUFFER
MDS 2309 D
6
Revision 052405
In te gr ated Circuit Systems
● 5 25 Race Stree t, San Jose, CA 951 26 ● te l (40 8) 2 97-12 01 ● www.icst.com
ICS2309
Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch)
Package dimensions are kept current with JEDEC Publication No. 95
Thermal Characteristics for 16TSSOP
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Thermal Resistance Junction to
Ambient
θ
JA
Still air
78
°C/W
θ
JA
1 m/s air flow
70
°C/W
θ
JA
3 m/s air flow
68
°C/W
Thermal Resistance Junction to Case
θ
JC
37
°C/W
INDEX
AREA
1 2
16
D
E1
E
SEATING
PLANE
A
1
A
A
2
e
- C -
b
.10 (.004)
C
c
L
Millimeters
Inches
Symbol
Min
Max
Min
Max
A
--
1.20
--
0.047
A1
0.05
0.15
0.002
0.006
A2
0.80
1.05
0.032
0.041
b
0.19
0.30
0.007
0.012
C
0.09
0.20
0.0035
0.008
D
4.90
5.1
0.193
0.201
E
6.40 BASIC
0.252 BASIC
E1
4.30
4.50
0.169
0.177
e
0.65 Basic
0.0256 Basic
L
0.45
0.75
0.018
0.030
α
0
°
8
°
0
°
8
°



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