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MPC755 Fiches technique(PDF) 25 Page - Motorola, Inc |
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MPC755 Fiches technique(HTML) 25 Page - Motorola, Inc |
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25 / 56 page ![]() MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor 25 Pin Assignments Figure 17 (in Part A) shows the pinout of the MPC755, 360 PBGA and 360 CBGA packages as viewed from the top surface. Part B shows the side profile of the PBGA and CBGA package to indicate the direction of the top surface view. Part A Figure 17. Pinout of the MPC755, 360 PBGA and CBGA Packages as Viewed from the Top Surface A B C D E F G H J K L M N P R T 12 3 4 5 6 78 910 11 12 13 14 15 16 Not to Scale 17 18 19 U V W View Part B Die Substrate Assembly Encapsulant |
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