MPC755 datasheet(34/56 Pages) MOTOROLA

No de pièce	MPC755

Description	RISC Microprocessor Hardware Specifications

PDF	56 Pages

Scroll/Zoom	100%

Fabricant	MOTOROLA [Motorola, Inc]

Site Internet	http://www.freescale.com

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MPC755 RISC Microprocessor Hardware Specifications, Rev. 6.1

Freescale Semiconductor

Package Description

7.4 Mechanical Dimensions for the MPC755 CBGA

Figure 19 provides the mechanical dimensions and bottom surface nomenclature for the MPC755, 360 CBGA

package.

Figure 19. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC755,

360 CBGA Package

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.

3. TOP SIDE A1 CORNER INDEX IS A METALIZED

FEATURE WITH VARIOUS SHAPES. BOTTOM

SIDE A1 CORNER IS DESIGNATED WITH A BALL

MISSING FROM THE ARRAY.

360X

123456789 10 11 12 13 14 15 16

0.3

0.15

0.2 C

17 18 19

Millimeters

DIM

Min

Max

2.65

3.20

0.79

0.99

1.10

1.30

—

0.60

0.82

0.93

25.00 BSC

6.75

25.00 BSC

7.87

1.27 BSC

0.2

A1 CORNER

0.2

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