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ST25DV64K Fiches technique(PDF) 186 Page - STMicroelectronics |
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ST25DV64K Fiches technique(HTML) 186 Page - STMicroelectronics |
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186 / 220 page ![]() Package information ST25DV04K ST25DV16K ST25DV64K 186/220 DocID027603 Rev 4 10.3 UFDFN8 package information Figure 80. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package outline 1. Max. package warpage is 0.05 mm. 2. Exposed copper is not systematic and can appear partially or totally according to the cross section. 3. Drawing is not to scale. Table 218. UFDFN8 - 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.450 0.550 0.600 0.0177 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 b(2) 0.200 0.250 0.300 0.0079 0.0098 0.0118 D 1.900 2.000 2.100 0.0748 0.0787 0.0827 D2 1.200 - 1.600 0.0472 - 0.0630 E 2.900 3.000 3.100 0.1142 0.1181 0.1220 E2 1.200 - 1.600 0.0472 - 0.0630 |
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