1. Product Description:

️· Product Name: DuPont LF171
️· Type: Conductive Paste / Inks (likely for hybrid microcircuits and networks)
️· Key Features:
- Excellent fine-line resolution
- "Lead, cadmium, and nickel free" (trace amounts may still be present)
- Excellent solderability (lead and lead-free)
- Good green strength
- Compatible with DuPont LF151 dielectric for crossover applications.

2. Processing Conditions:

️· Printing:
- Screen mesh: 200-325 mesh stainless steel
- Emulsion: 0.3 - 0.5 mil
- Print speed: up to 20 cm/s
️· Drying: 5-10 minutes at room temperature, then 10-15 minutes at 150°C
️· Firing: Peak temperature of 850°C, held for 10 minutes within a 30-minute cycle in an air (oxidizing) atmosphere.

3. Technical Specifications (Typical Values):

️· Viscosity: 180-220 Pa.s (Brookfield HBT, UC&SP @ 10 rpm, 25°C)
️· Thinner: DuPont 4553
️· Retest Time: 6 months
️· Shrinkage (dried to fired): 35-40%
️· Mean Fired Thickness (using 200 mesh): 13-19 µm (typical 16 µm)
️· Coverage @ 16 µm fired: 70 cm²/g
️· Resistivity @ 16 µm fired: ≤ 2.5 mΩ/sq
️· Adhesion (90° wire peel test): ≥ 20 N (on 2mm x 2mm pad soldered with 62/36/2 solder, using mildly activated flux on 96% alumina)

4. Material Compatibility and Use:

️· Substrates: Compatible with Al2O3 and BeO.
️· Thinner: DuPont 4553 is the recommended thinner.
️· General Notes: Performance depends on careful screen printing techniques. Keep equipment clean and free of contamination.

5. Contact Information:

️· Provides contact information for DuPont Microcircuit Materials offices in the Americas, Europe, and Asia.

6. Legal Disclaimer:

️· Standard legal disclaimers regarding product liability, warranties, and patent infringements.
️· Caution regarding medical applications.