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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MPC7457 Fiches technique(PDF) 44 Page - Freescale Semiconductor, Inc |
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MPC7457 Fiches technique(HTML) 44 Page - Freescale Semiconductor, Inc |
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44 / 68 page  MPC7457 RISC Microprocessor Hardware Specifications, Rev. 5 44 Freescale Semiconductor Package Description 8.4 Package Parameters for the MPC7457, 483 CBGA The package parameters are as provided in the following list. The package type is 29 × 29 mm, 483-lead ceramic ball grid array (CBGA). Package outline 29 × 29 mm Interconnects 483 (22 × 22 ball array – 1) Pitch 1.27 mm (50 mil) Minimum module height — Maximum module height 3.22 mm Ball diameter 0.89 mm (35 mil) 8.5 Mechanical Dimensions for the MPC7457, 483 CBGA Figure 22 provides the mechanical dimensions and bottom surface nomenclature for the MPC7457, 483 CBGA package. |
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