Package information

ESDALC6-4N4

6/11

Doc ID 022191 Rev 2

3

Package information

●

Epoxy meets UL94, V0

●

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Note:

Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no

case should this product marking be used to orient the component for its placement on a

PCB. Only pin 1 mark is to be used for this purpose.

Table 3.

Ref.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.31

0.38

0.40

0.012

0.015

0.016

A1

0.00

0.02

0.05

0.00

0.0008 0.002

b

0.10

0.15

0.20

0.004

0.006

0.008

D

0.70

0.80

0.90

0.028

0.031

0.035

D2

0.50

0.58

0.65

0.020

0.023

0.026

e

0.35

0.40

0.45

0.014

0.016

0.018

E

0.90

1.00

1.10

0.035

0.039

0.043

E2

0.15

0.20

0.25

0.006

0.008

0.010

L

0.18

0.23

0.28

0.007

0.009

0.011

L1

0.00

--

0.05

0.00

--

0.002

Figure 14.

Footprint dimensions (in mm) Figure 15.

Marking

A

A1

D

E

D2

e

E2

L1

b

L

1

4

2

3

Index

area

0.4

0.43

0.2

0.18

0.17

0.58

0.58

1.4