STM32L162RE datasheet(23/129 Pages) STMICROELECTRONICS

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STM32L162xE

Functional overview

3.7

Memories

The STM32L162xE devices have the following features:

•

80 Kbytes of embedded RAM accessed (read/write) at CPU clock speed with 0 wait

states. With the enhanced bus matrix, operating the RAM does not lead to any

performance penalty during accesses to the system bus (AHB and APB buses).

•

The non-volatile memory is divided into three arrays:

–

512 Kbytes of embedded Flash program memory

–

16 Kbytes of data EEPROM

–

Options bytes

Flash program and data EEPROM are divided into two banks, this enables writing in

one bank while running code or reading data in the other bank.

The options bytes are used to write-protect or read-out protect the memory (with 4

Kbytes granularity) and/or readout-protect the whole memory with the following

options:

–

Level 0: no readout protection

–

Level 1: memory readout protection, the Flash memory cannot be read from or

written to if either debug features are connected or boot in RAM is selected

–

Level 2: chip readout protection, debug features (ARM Cortex-M3 JTAG and serial

wire) and boot in RAM selection disabled (JTAG fuse)

The whole non-volatile memory embeds the error correction code (ECC) feature.

3.8

DMA (direct memory access)

The flexible 12-channel, general-purpose DMA is able to manage memory-to-memory,

peripheral-to-memory and memory-to-peripheral transfers. The DMA controller supports

circular buffer management, avoiding the generation of interrupts when the controller

reaches the end of the buffer.

Each channel is connected to dedicated hardware DMA requests, with software trigger

support for each channel. Configuration is done by software and transfer sizes between

source and destination are independent.

The DMA can be used with the main peripherals: AES, SPI, I2C, USART, general-purpose

timers, DAC and ADC.

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