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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ST7MC1K2-Auto Fiches technique(PDF) 352 Page - STMicroelectronics |
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ST7MC1K2-Auto Fiches technique(HTML) 352 Page - STMicroelectronics |
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352 / 371 page  Obsolete Product(s) - Obsolete Product(s) Package characteristics ST7MC1K2-Auto, ST7MC1K6-Auto, ST7MC2S4-Auto, ST7MC2S6-Auto 352/371 13 Package characteristics 13.1 ECOPACK® In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 13.2 LQFP packages The following pages contain the package drawings and mechanical data as well as the thermal characteristics and soldering information for the 44- and 32-pin LQFP packages. Obsolete Product(s) - Obsolete Product(s) |
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