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TMP93CS32F Fiches technique(PDF) 14 Page - Toshiba Semiconductor

No de pièce TMP93CS32F
Description  Quality And Reliability Assurance / Handling Precautions
PDF  48 Pages
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Fabricant  TOSHIBA [Toshiba Semiconductor]
Site Internet  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TMP93CS32F Fiches technique(HTML) 14 Page - Toshiba Semiconductor

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Quality and Reliability Assurance / Handling Precautions
030901
QUA-14
2002-02-20
(3)
870 Series
Table 2.5
Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (1/3)
Products
Name
Air reflow
Infrared reflow
TMP87C800F
A(168h)
A(168h)
TMP87CH00F
A(168h)
A(168h)
TMP87PH00F
B(72h)
B(72h)
TMP87C800DF
A(168h)
A(168h)
TMP87CH00DF
A(168h)
A(168h)
TMP87CH00LF
A(168h)
A(168h)
TMP87PH00DF
B(72h)
B(72h)
TMP87PH00LF
A(168h)
A(168h)
TMP87C807U
A(168h)
A(168h)
TMP87C408M
A(168h)
A(168h)
TMP87C408LM
A(168h)
A(168h)
TMP87C808M
A(168h)
A(168h)
TMP87C808LM
A(168h)
A(168h)
TMP87C408DM
A(168h)
A(168h)
TMP87P808M
A(168h)
A(168h)
TMP87P808LM
A(168h)
A(168h)
TMP87C814F
A(168h)
A(168h)
TMP87CH14F
A(168h)
A(168h)
TMP87CK14F
A(168h)
A(168h)
TMP87CM14F
A(168h)
A(168h)
TMP87PM14F
B(72h)
B(72h)
TMP87CC20F
A(168h)
A(168h)
TMP87CH20F
A(168h)
A(168h)
TMP87PH20F
B(72h)
B(72h)
TMP87CK20AF
A(168h)
A(168h)
TMP87CM20AF
A(168h)
A(168h)
TMP87PM20F
B(72h)
B(72h)
TMP87CH21F
A(168h)
A(168h)
TMP87CH21BF
A(168h)
A(168h)
TMP87CH21DF
A(168h)
A(168h)
TMP87CH21BDF
A(168h)
A(168h)
TMP87CM21F
A(168h)
A(168h)
TMP87CM21DF
A(168h)
A(168h)
TMP87PP21F
B(72h)
B(72h)
TMP87PP21DF
A(168h)
A(168h)
TMP87CM23F
A(168h)
A(168h)
TMP87CP23F
A(168h)
A(168h)
TMP87PP23F
B(72h)
B(72h)
TMP87CM24AF
A(168h)
A(168h)
TMP87CP24AF
A(168h)
A(168h)
TMP87PP24AF
A(168h)
A(168h)
TMP87CH29U
A(168h)
A(168h)
TMP87CK29U
A(168h)
A(168h)
TMP87CM29U
A(168h)
A(168h)
TMP87PM29U
A(168h)
A(168h)
Note 1:
As of March, 2001
Note 2:
Symbols A (168h), B (72h), C (48h), D (24h), E(12h),
G and indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device.
For
details of these conditions, please refer to Table 2.2.



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