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STM32F303XD Fiches technique(PDF) 156 Page - STMicroelectronics |
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STM32F303XD Fiches technique(HTML) 156 Page - STMicroelectronics |
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156 / 173 page ![]() Package information STM32F303xD STM32F303xE 156/173 DocID026415 Rev 5 7.3 UFBGA100 package information UFBGA100 is a 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package. Figure 57. UFBGA100 package outline 1. Drawing is not to scale. Table 93. UFBGA100 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A 0.460 0.530 0.600 0.0181 0.0209 0.0236 A1 0.050 0.080 0.110 0.0020 0.0031 0.0043 A2 0.400 0.450 0.500 0.0157 0.0177 0.0197 A3 - 0.130 - - 0.0051 - A4 0.270 0.320 0.370 0.0106 0.0126 0.0146 b 0.200 0.250 0.300 0.0079 0.0098 0.0118 D 6.950 7.000 7.050 0.2736 0.2756 0.2776 D1 5.450 5.500 5.550 0.2146 0.2165 0.2185 E 6.950 7.000 7.050 0.2736 0.2756 0.2776 E1 5.450 5.500 5.550 0.2146 0.2165 0.2185 e - 0.500 - - 0.0197 - F 0.700 0.750 0.800 0.0276 0.0295 0.0315 |
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