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PACKAGE OUTLINE

C

TYP

6.6

6.2

14X 0.65

16X

0.30

0.19

2X

4.55

(0.15) TYP

0 - 8

0.15

0.05

1.2 MAX

3.40

2.68

2.48

1.75

4X 0.18 MAX

NOTE 5

4X (0.3)

NOTE 5

2X (0.95)

0.25

GAGE PLANE

0.75

0.50

A

NOTE 3

5.1

4.9

B

4.5

4.3

PowerPAD

TSSOP - 1.2 mm max height

PWP0016D

PLASTIC SMALL OUTLINE

4223219/A 08/2016

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. Reference JEDEC registration MO-153.

5. Features may differ and may not be present.

PowerPAD is a trademark of Texas Instruments.

TM

1

16

0.1

C A B

9

8

PIN 1 ID AREA

SEATING PLANE

0.1 C

SEE DETAIL A

DETAIL A

TYPICAL

SCALE 2.250

THERMAL

PAD