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74LVC4066D Fiches technique(PDF) 19 Page - NXP Semiconductors |
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74LVC4066D Fiches technique(HTML) 19 Page - NXP Semiconductors |
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19 / 23 page ![]() 2003 Aug 12 19 Philips Semiconductors Product specification Quad bilateral switches 74LVC4066 PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD(1) E(1) (1) eHE LLp Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 1.75 0.25 0.10 1.55 1.40 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 SOT108-2 X w M θ A A1 A2 b p D HE L p detail X E Z e c L v M A (A ) 3 A 7 8 1 14 y MS-012 pin 1 index 0.069 0.010 0.004 0.061 0.055 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 01-05-29 03-02-19 0 2.5 5 mm scale SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm SOT108-2 |
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