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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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RN4020 Fiches technique(PDF) 14 Page - Microchip Technology |
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RN4020 Fiches technique(HTML) 14 Page - Microchip Technology |
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14 / 28 page  RN4020 DS50002279B-page 14 2015 Microchip Technology Inc. FIGURE 7-2: ANTENNA PLOT FIGURE 7-3: 3D RADIATION PATTERN AND ANTENNA ORIENTATION 7.3 Soldering Recommendations The RN4020 wireless module is assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles. To avoid damaging the module, the following recom- mendations are given: • Microchip Technology Application Note, AN233 Solder Reflow Recommendation (DS00233) pro- vides solder reflow recommendations • Do not exceed peak temperature (Tp) of 250°C • Refer to the solder paste data sheet for specific reflow profile recommendations • Use no-clean flux solder paste • Do not wash as moisture can be trapped under the shield • Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. |
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