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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ST7MC1 Fiches technique(PDF) 288 Page - STMicroelectronics |
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ST7MC1 Fiches technique(HTML) 288 Page - STMicroelectronics |
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288 / 308 page  ST7MC1/ST7MC2 288/308 PACKAGE CHARACTERISTICS (Cont’d) 13.2 THERMAL CHARACTERISTICS Notes: 1. The maximum chip-junction temperature is based on technology characteristics. 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDD x VDD) and PPORT is the port power dissipation depending on the ports used in the application. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) LQFP80 14x14 LQFP64 14x14 LQFP44 10x10 LQFP32 7x7 SDIP32 400mil SDIP56 600mil 55 55 68 80 63 45 °C/W TJmax Maximum junction temperature1) 150 °C PDmax Power dissipation 2) 500 mW |
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