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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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ADV7181BBCPZ Fiches technique(PDF) 8 Page - Analog Devices |
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ADV7181BBCPZ Fiches technique(HTML) 8 Page - Analog Devices |
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8 / 96 page  ADV7181B Rev. 0 | Page 8 of 96 THERMAL SPECIFICATIONS Table 5. Parameter Symbol Test Conditions Min Typ Max Unit THERMAL CHARACTERISTICS Junction-to-Ambient Thermal Resistance (Still Air) θJA 4-layer PCB with solid ground plane, 64-lead LFCSP 45.5 °C/W Junction-to-Case Thermal Resistance θJC 4-layer PCB with solid ground plane, 64-lead LFCSP 9.2 °C/W Junction-to-Ambient Thermal Resistance (Still Air) θJA 4-layer PCB with solid ground plane, 64-lead LQFP 47 °C/W Junction-to-Case Thermal Resistance θJC 4-layer PCB with solid ground plane, 64-lead LQFP 11.1 °C/W TIMING DIAGRAMS SDA SCLK t3 t5 t3 t4 t8 t6 t7 t2 t1 Figure 2. I2C Timing OUTPUT LLC OUTPUTS P0–P15, VS, HS, FIELD, SFL t9 t10 t11 t12 Figure 3. Pixel Port and Control Output Timing |
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