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LP5904TME-2.7/NOPB Fiches technique(PDF) 12 Page - Texas Instruments

No de pièce LP5904TME-2.7/NOPB
Description  Ultra Low Noise, 200 mA Linear Regulator for RF/Analog Circuits - Requires No Bypass Capacitor
PDF  23 Pages
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Fabricant  TI1 [Texas Instruments]
Site Internet  http://www.ti.com
Logo TI1 - Texas Instruments

LP5904TME-2.7/NOPB Fiches technique(HTML) 12 Page - Texas Instruments

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IN
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P = (V
V
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LP5904
SNVS637G – MARCH 2011 – REVISED APRIL 2013
www.ti.com
APPLICATION INFORMATION
POWER DISSIPATION AND DEVICE OPERATION
The permissible power dissipation for any package is a measure of the capability of the device to pass heat from
the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power
dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces
between the die and ambient air. As stated in the Operating Ratings (1), the allowable power dissipation for the
device in a given package can be calculated using the equation:
(1)
The actual power dissipation across the device can be represented by the following equation:
(2)
This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage
drop across the device, and the continuous current capability of the device. These two equations should be used
to determine the optimum operating conditions for the device in the application.
EXTERNAL CAPACITORS
Like any low-dropout regulator, the LP5904 requires external capacitors for regulator stability. The LP5904 is
specifically designed for portable applications requiring minimum board space and smallest components. These
capacitors must be correctly selected for good performance.
INPUT CAPACITOR
An input capacitor is required for stability. The input capacitor should be at least equal to, or greater than, the
output capacitor for good load transient performance. At least a 1.0 µF capacitor has to be connected between
the LP5904 input pin and ground for stable operation over full load current range. Basically, it is ok to have more
output capacitance than input, as long as the input is at least 1.0 µF.
This capacitor must be located a distance of not more than 1cm from the input pin and returned to a clean
analog ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
NOTE
Important: To ensure stable operation it is essential that good PCB practices are
employed to minimize ground impedance and keep input inductance low. If these
conditions cannot be met, or if long leads are to be used to connect the battery or other
power source to the LP5904, then it is recommended to increase the input capacitor to at
least 10 µF. Also, tantalum capacitors can suffer catastrophic failures due to surge current
when connected to a low-impedance source of power (like a battery or a very large
capacitor). If a tantalum capacitor is used at the input, it must be specified by the
manufacturer to have a surge current rating sufficient for the application. There are no
requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but
tolerance and temperature coefficient must be considered when selecting the capacitor to
ensure the capacitance will remain 1.0 µF ±30% over the entire operating temperature
range.
OUTPUT CAPACITOR
The LP5904 is designed specifically to work with a very small ceramic output capacitor, typically 1.0 µF. A
ceramic capacitor (dielectric types X5R or X7R) in the 0.5 µF to 10 µF range, and with ESR between 5m
Ω to 500
m
Ω, is suitable in the LP5904 application circuit. For this device the output capacitor should be connected
between the VOUT pin and a good ground connection.
(1)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-
OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance
of the part/package in the application
θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). See
APPLICATION INFORMATION.
12
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Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: LP5904



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