LP5904TME-2.7SLASHNOPB datasheet(3/23 Pages) TI1

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LP5904

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SNVS637G – MARCH 2011 – REVISED APRIL 2013

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN

Input Voltage

–0.3

6.0

VOUT

Output Voltage

–0.3 to (VIN + 0.3V)

6.0

VEN

Enable Input Voltage

–0.3 to (VIN + 0.3V)

6.0

Continuous Power Dissipation(4)

Internally Limited

Junction Temperature (TJMAX)

150

°C

Storage Temperature Range

–65

150

°C

Maximum Lead Temperature (Soldering, 10 sec.)

260

°C

Human Body Model

ESD Rating(5)

Machine Model

200

(1)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(3)

All voltages are with respect to the potential at the GND pin.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

(5)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

OPERATING RATINGS

(1) (2)

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input Voltage Range

2.2

5.5

VEN

Enable Voltage Range

0 to (VIN + 0.3)

5.5

Recommended Load Current(3)

200

Junction Temperature Range

–40

+125

°C

Ambient Temperature Range(3)

–40

+85

°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). See applications section.

THERMAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

JEDEC Board (DSBGA)(2)

119.6

°C/W

θJA

Junction to Ambient Thermal Resistance(1)

4L Cellphone Board (DSBGA)

186.5

°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

(2)

Detailed description of the board can be found in JESD51-7

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