GaAs SPDT Switch

DC - 20 GHz

Rev. V5

MASW20000

4

4

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Handling Procedures

Permanent damage to the MASW20000 may occur if the

following precautions are not adhered to:

A. Cleanliness - The MASW20000 should be handled in

a clean environment.

DO NOT attempt to clean

assembly after the MASW20000 is installed.

B. Static Sensitivity - All die handling equipment and

personnel should be DC grounded.

C. Transients - Avoid instrument and power supply

transients

while

bias

is

connected

to

the

MASW20000. Use shielded signal and bias cables

to minimize inductive pick-up.

D. Bias - Apply voltage to either control port A1/B2 or

A2/B1 only when the other is grounded. Neither port

should be allowed to ―float‖.

E. General Handling - It is recommended that the

MASW20000 chip be handled along the long side of

the die with a sharp pair of bent tweezers. DO NOT

touch the surface of the chip with fingers or

tweezers.

Mounting

The MASW20000 is back-metallized with Pd/Ni/Au

(100/1,000/30,000Å) metallization. It can be die-mounted

using Au/Sn eutectic preforms or a thermally conductive

epoxy. The package surface should be clean and flat

before attachment.

Eutectic Die Attach:

A. An 80/20 Au/Sn preform is recommended with a

work surface temperature of approximately 255°C

and a tool temperature of 265°C. When hot 90/10

nitrogen/hydrogen gas is applied, solder temperature

should be approximately 290°C.

B. DO NOT expose the MASW20000 to a temperature

greater than 320°C for more than 20 seconds. No

more than 3 seconds of scrubbing should be

required for attachment.

Epoxy Die Attach:

A. Apply a minimum amount of epoxy and place the

MASW20000 into position. A thin epoxy fillet should

be visible around the perimeter of the die.

B. Cure epoxy per manufacturer’s recommended

schedule.

C. Electrically conductive epoxy is recommended but is

not required.

Wire Bonding

A. Ball or wedge bond with 1.0 mil diameter pure gold

wire. Gold ribbon (3.0 mil x 0.5 mil) may also be

used. Thermo sonic wire bonding with a nominal

stage temperature of 150°C and a ball bonding force

of 40 to 50 grams or wedge bonding force of 18 to

22 grams is recommended. Ultrasonic energy and

time should be adjusted to the minimum levels to

achieve reliable wirebonds.

nated on the package.