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LP5907 Fiches technique(PDF) 21 Page - Texas Instruments |
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LP5907 Fiches technique(HTML) 21 Page - Texas Instruments |
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21 / 36 page ![]() EXAMPLE BOARD LAYOUT DQN0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD 4215302/C 11/2015 NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 21 LP5907 www.ti.com SNVS798J – APRIL 2012 – REVISED MARCH 2016 Product Folder Links: LP5907 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated |
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